Soprema Thermaclass Cavity Wall 21 1190 x 450 x 115mm

Thermaclass Cavity Wall 21 is an easy to install, polyisocyanurate (PIR) insulation board for full fill cavity wall applications, with excellent thermal performance (0.021 W/m.K). Featuring a low emissivity foil facing, it can be installed with up to a 10mm residual cavity (to support ease of installation and accommodate mortar squeeze) or as a full fill solution with no residual cavity. Another significant benefit of Thermaclass Cavity Wall 21 is that it does not require board joints to be taped, saving both time and additional cost to the installer. The tongue and groove edge profile helps to keep the boards in line and acts as the barrier to water ingress by preventing water from tracking between the board joints. Excellent thermal performance with a thermal conductivity of 0.021 W/m.K, reducing the thickness of insulation required to hit the target U-value. Low emissivity foil facing provides improved thermal performance in sealed cavity air spaces, improving the achievable U-value Based on a residual cavity of 10mm The boards are sized to fit standard cavity wall tie spacing. They are light and rigid, assisting with ease of transportation, handling and fitting. Another significant benefit of Thermaclass Cavity Wall 21 is that it does not require board joints to be taped, saving both time and additional cost to the installer. The tongue and groove edge profile helps to keep the boards in line and acts as the barrier to water ingress by preventing water from tracking between the board joints.